PM Modi to inaugurate HCL-Foxconn semiconductor plant in UP on February 21

Prime Minister Narendra Modi will virtually participate in the groundbreaking ceremony of the HCL–Foxconn joint venture project, India Chip Pvt. Ltd., at the Yamuna Expressway Industrial Development Authority (YEIDA), Uttar Pradesh, at 5 pm on February 21.

The prime minister will also address the gathering during the event, according to a statement from the Prime Minister’s Office.

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‎The new semiconductor facility, a collaboration between HCL Group and Foxconn, represents a major milestone in India’s drive toward technological self-reliance and strengthens the country’s vision of becoming a global hub for high-end electronics and semiconductor manufacturing.

‎The Outsourced Semiconductor Assembly and Test (OSAT) plant will be developed under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), with an investment exceeding Rs 3,700 crore. Strategically located within YEIDA, the facility aims to bolster domestic manufacturing capabilities and reduce dependence on semiconductor imports.
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“This project not only strengthens India’s manufacturing base but also demonstrates our commitment to building resilient global supply chains,” the release noted. The plant is expected to support a wide range of industries, including mobile phones, laptops, tablets, automotive electronics, and other consumer devices.

‎Officials highlighted that the initiative will boost India’s semiconductor ecosystem by promoting innovation, technology transfer, and skill development. It is projected to create thousands of direct and indirect jobs for engineers, technicians, and other skilled professionals while stimulating growth in ancillary and support industries.

‎The HCL-Foxconn partnership is seen as a significant step in realizing India’s goal of a robust, self-reliant electronics manufacturing ecosystem and enhancing the country’s presence in the global semiconductor landscape.