The Union Cabinet on Tuesday approved four semiconductor projects under the India Semiconductor Mission (ISM), Minister of Information and Broadcasting Ashwin Vaishnaw said.
The projects, worth Rs 4,600 crore, will be set up in Odisha, Punjab, and Andhra Pradesh, and are expected to generate employment for 2,034 skilled professionals.
The approved proposals are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies.
These projects will set up semiconductor manufacturing facilities, including India’s first commercial compound fab and a highly advanced glass-based substrate semiconductor packaging unit.
SiCSem will set up a Silicon Carbide (SiC) based Compound Semiconductors facility in Odisha, with an annual capacity of 60,000 wafers and packaging capacity of 96 million units.
3D Glass Solutions Inc. will establish a vertically integrated advanced packaging and embedded glass substrate unit in Odisha, with a capacity of approximately 69,600 glass panel substrates per annum.
Advanced System in Package Technologies (ASIP) will set up a semiconductor manufacturing unit in Andhra Pradesh, with an annual capacity of 96 million units.
Continental Device India Private Limited (CDIL) will expand its discrete semiconductor manufacturing facility in Punjab, with an annual capacity of 158.38 million units.
The Minister said that the approval of these projects will significantly contribute to making India self-reliant in the semiconductor sector, with applications in various industries such as defense, automotive, consumer electronics, and renewable energy. The projects will also complement the growing chip design capabilities in the country.